Date : 11-01-18 13:29
Organic EL display manufactured Encapsulat
 Author : Lantech
Views : 1,210  
Organic EL display manufactured Encapsulat



Lantechnical Service Co., Ltd. bonding equipment for organic EL display production has been developed for OLED/PLED Encapsulation.

Feature

Original non-contact pressurizing system ensures precise gap retention and Encapsulation operations. All processes are performed in a nitrogen-filled environment (glove box).
The modular system enables flexible layout of function units according to manufacturing needs.

Substrate sizes
200×200mm
400×400mm
370×470mm
550×650mm
610×720mm
730×920mm
Substrate thickness
1.1mm?0.7mm?0.55mm
Positioning
Positioning by CCD camera +XYθ stage
Accuracy
±5~50μm
UV Curing
Air-cooled metal halide lamps,14 kW×2 lamps
Substrate surface temperature
50℃ maximum (6000mj/cm^(2))