Organic EL display manufactured Encapsulat
Lantechnical Service Co., Ltd. bonding equipment for organic EL display production has been developed for OLED/PLED Encapsulation.
Original non-contact pressurizing system ensures precise gap retention and Encapsulation operations. All processes are performed in a nitrogen-filled environment (glove box).
The modular system enables flexible layout of function units according to manufacturing needs.
- Substrate sizes
- 200×200mm
400×400mm
370×470mm
550×650mm
610×720mm
730×920mm
- Substrate thickness
- 1.1mm?0.7mm?0.55mm
- Positioning
- Positioning by CCD camera +XYθ stage
- Accuracy
- ±5~50μm
- UV Curing
- Air-cooled metal halide lamps,14 kW×2 lamps
- Substrate surface temperature
- 50℃ maximum (6000mj/cm^(2))