Vacuum Panel Assembly Equipment
This equipment is suited for assembling where the main purpose is to prevent trapping of air bubbles inside the panel.
- Standard Specifications
- Substrate size Max 730X920mm
Vacuum 1X10-1pa (Order)
Pressure Max 2kg/cm2
Alignment accuracy ±2μm
Substrate fixing Electrostatic chuck
※Hot plate or spot UV for curing within the bonding equipment can be added optionally.
- Main applications
- Organic EL (AMOLED), small crystals, CMOS sensor , touch panel, solar
- cells etc.
- Substrate: Glass, wafer, plastic, film etc.
Customization for matching your specifications is possible.
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