Date : 11-01-18 13:42
Vacuum Hot-Chill Plate
 Author : Lantech
Views : 1,216  
Vacuum Hot-Chill Plate




 

The fundamental technique in the stabilization of surface material is to precisely control the rise and fall in the temperature of substrates. Because the heating and cooling processes were divided in conventional methods, it had been difficult to control the stabilization of the target material. The heating and cooling of this Hot/Chill plate can be precisely controlled. It is also possible under atmospheric conditions.
This product is being sold in collaboration with JSS.

Feature

Standard Specifications
Substrate size Max730×920mm
temperature 250℃
Uniformity below ±2℃
Temperature rise rate 30℃/min
Temperature fall rate 20℃/min
※Customization for Roll to Roll etc. is possible.